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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPXV4115V/D Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV4115V series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure/vacuum. The small form factor and high reliability of on-chip integration make the Motorola sensor a logical and economical choice for the automotive system designer. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * 1.5 % Maximum error over 0 to 85C * Temperature Compensated from -40 + 125C * Ideally Suited for Microprocessor or Microcontroller-Based Systems * Durable Thermoplastic (PPS) Surface Mount Package Application Examples * Vacuum Pump Monitoring * Brake Booster Monitoring MPXV4115V SERIES INTEGRATED PRESSURE SENSOR -115 to 0 kPa (-16.7 to 2.2 psi) 0.2 to 4.6 V OUTPUT SMALL OUTLINE PACKAGE MPXV4115VC6U CASE 482A VS SENSING ELEMENT THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY MPXV4115V6U CASE 482 Vout PIN NUMBER 1 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C 2 3 4 PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE GND Figure 1. Fully Integrated Pressure Sensor Schematic NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. REV 1 Motorola Sensor Device Data (c) Motorola, Inc. 2001 1 MPXV4115V SERIES MAXIMUM RATINGS(NOTE) Parametrics Maximum Pressure Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 400 -40 to + 125 -40 to + 125 Unit kPa C C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5 Vdc, TA = 25 C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Pressure Range (Differential mode, Vacuum on metal cap side, Atmospheric pressure on back side) Supply Voltage(1) Supply Current Full Scale Output (2) (0 to 85 C) (Pdiff = 0 kPa) 2 Full Scale Span (3) (0 to 85 C) @Vs = 5.0 V Accuracy (4) (0 to 85 C) Sensitivity Response Time (5) Output Source Current at Full Scale Output Warm-Up Time (6) Offset Stability (7) Symbol POP VS Io VFSO VFSS Min -115 4.75 -- 4.535 Typ -- 5 6.0 4.6 4.4 Max 0 5.25 10 4.665 Unit kPa Vdc mAdc Vdc Vdc -- V/P tR Io -- -- -- -- -- -- -- 38.26 1.0 0.1 20 0.5 1.5% -- -- -- -- -- %VFSS mV/kPa ms mAdc ms %VFSS NOTES: 1. Device is ratiometric within the specified excitation voltage range. 2. Full-scale output is defined as the output voltage at the maximum or full-rated pressure. 3. Full-scale span is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum-rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 C due to all sources of errors, including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data MPXV4115V SERIES ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4115V series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to differential pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 0C to 85C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. FLUOROSILICONE GEL DIE COAT P1 WIRE BOND DIE STAINLESS STEEL CAP +5 V Vout Vs IPS OUTPUT THERMOPLASTIC CASE LEAD FRAME 1.0 mF 0.01 mF GND 470 pF P2 DIFFERENTIAL SENSING ELEMENT DIE BOND Figure 2. Cross-Sectional Diagram (Not to Scale) Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. OUTPUT (VOLTS) TRANSFER FUNCTION: 4.5 V = V *[(0.007652*P) + 0.92] (Pressure error out S 4 *Temp Factor*0.007652*VS) VS = 5.0 V 0.25 Vdc 3.5 TEMP = 0-85 C 3 2.5 2 1.5 1 0.5 0 -115 -95 -75 -55 Vout vs. VACUUM -35 -15 MAX MIN 5 TRANSFER FUNCTION MPXV4115V Figure 4. Applied Vacuum in kPa (below atmospheric pressure) Motorola Sensor Device Data 3 MPXV4115V SERIES ORDERING INFORMATION The MPXV4115V series pressure sensors are available in the basic element package or with a pressure port. Two packing options are also offered. Device Type MPXV4115V6U MPXV4115V6T1 MPXV4115VC6U Case No. No 482 482 482A Rails Tape and Reel Rails Packing Options Device Marking MPXV4115V MPXV4115V MPXV4115V MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct fottprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) 4 Motorola Sensor Device Data MPXV4115V SERIES Transfer Function Nominal Transfer Value: Vout = VS (P x 0.007652 ) ) 0.92) +/- (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5 V 0.25 Vdc Temperature Error Band MPXV4115V Series 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 Temp - 40 0 to 85 +125 Multiplier 3 1 3 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0 to -40C and from 85 to 125C. Pressure Error Band 1.950 Pressure Error (kPa) 1.725 1.500 0 -115 -100 -85 -60 -45 -30 -15 0 Pressure in kPa (below atmospheric) -1.500 - 1.725 - 1.950 Pressure -115 to 0 kPa Error (Max) "1.725 (kPa) Motorola Sensor Device Data 5 MPXV4115V SERIES SMALL OUTLINE PACKAGE DIMENSIONS -A- 5 4 D 8 PL 0.25 (0.010) M TB S A S -B- 8 G 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41 S N C H -T- K M PIN 1 IDENTIFIER SEATING PLANE J CASE 482-01 ISSUE O -A- 5 4 D 8 PL 0.25 (0.010) M TB S A S N -B- 8 G 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -T- SEATING PLANE CASE 482A-01 ISSUE A 6 Motorola Sensor Device Data MPXV4115V SERIES Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 Technical Information Center: 1-800-521-6274 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2, Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 HOME PAGE: http://www.motorola.com/semiconductors/ Motorola Sensor Device Data 7 MPXV4115V/D |
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